Adhesion in Microelectronics

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion  (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings